RF absorber thermal pad gap filler solutions from 2 – 18 GHz
DU Series Overview
Our DU Series RF Absorber Thermal Pad is a dual-use material engineered for both radio frequency absorption and thermal management. Constructed from an iron/ceramic-loaded silicone elastomer, it provides effective RFI suppression from 2 to 18 GHz while simultaneously conducting heat away from sensitive electronic components.
Available in thermal conductivities of 1.5 W/mK or 2.5 W/mK, the DU Series balances electrical and thermal performance in compact designs. Its soft, conformable composition fills air gaps, reduces cavity resonances, and maintains stability under thermal cycling. Standard thicknesses of 0.020″, 0.040″, 0.060″, and 0.080″ are available, with custom dimensions and die-cut parts offered for specific applications.
This unique combination of absorber and thermal pad functions makes the DU Series ideal for next-generation electronics where both signal integrity and thermal reliability are critical. By combining two functions into one material, engineers can reduce part counts, simplify assembly, and achieve more efficient system integration. The DU Series is particularly well-suited for telecom infrastructure, optical modules, interconnects, automotive radar, aerospace avionics, and high-density industrial electronics, where heat buildup and RFI can degrade performance if left unmanaged.
