RF absorbers and thermal management materials usually compete for the same physical space. A power amplifier needs a thermal pad to move heat to a heatsink. The same component is also a strong source of EMI that needs absorption. Stack two materials and you’ve added thickness, weight, and assembly complexity. The DU Series solves this by combining both functions in a single material: a silicone elastomer loaded with both magnetic filler (for RF absorption from 2.0 to 18.0 GHz) and thermally conductive filler (for heat transfer at 1.5 or 2.5 W/mK).

The DU Series is most commonly deployed in RF power amplifiers where heat dissipation and EMI suppression compete for the same space, FPGA modules and high-speed processors with both thermal and emissions concerns, radar transmit/receive modules in compact phased array assemblies, and high-power signal processing hardware where stackup thickness is constrained. The pad sits between the heat-generating component and the heatsink or chassis, providing thermal interface and EMI suppression simultaneously.

The DU Series is available in 0.020″, 0.040″, 0.060″, and 0.080″ thicknesses across two thermal conductivity grades: 1.5 W/mK and 2.5 W/mK. Thickness selection is driven by target frequency: 0.080″ for 2 to 6 GHz, 0.060″ for 6 to 10 GHz, 0.040″ for 10 to 14 GHz, and 0.020″ for 14 GHz and above. The 1.5 and 2.5 W/mK grades have measurably different RF absorption profiles. Engineers select based on whether thermal performance or RF attenuation is the primary requirement, then verify the secondary parameter meets the application’s needs. Self-tack on both faces eliminates the need for adhesive backing. Compression in the assembly holds the pad in place.