DU SERIES | RF ABSORBERS
RF absorber thermal pad gap filler solutions from 2 to 18 GHz.
DU Series Overview
Our DU Series RF Absorber Thermal Pad is a dual-use material engineered for both radio frequency absorption and thermal management. Constructed from an iron/ceramic-loaded silicone elastomer, it provides effective RFI suppression from 2 to 18 GHz while simultaneously conducting heat away from sensitive electronic components.
Available in thermal conductivities of 1.5 W/mK or 2.5 W/mK, the DU Series balances electrical and thermal performance in compact designs. Its soft, conformable composition fills air gaps, reduces cavity resonances, and maintains stability under thermal cycling. Standard thicknesses of 0.020″, 0.040″, 0.060″, and 0.080″ are available, with custom dimensions and die-cut parts offered for specific applications.
This unique combination of absorber and thermal pad functions makes the DU Series ideal for next-generation electronics where both signal integrity and thermal reliability are critical. By combining two functions into one material, engineers can reduce part counts, simplify assembly, and achieve more efficient system integration. The DU Series is particularly well-suited for telecom infrastructure, optical modules, interconnects, automotive radar, aerospace avionics, and high-density industrial electronics, where heat buildup and RFI can degrade performance if left unmanaged.
Key Features
Applications
Common Frequencies
DU Series Overview
Our DU Series RF Absorber Thermal Pad is a dual-use material engineered for both radio frequency absorption and thermal management. Constructed from an iron/ceramic-loaded silicone elastomer, it provides effective RFI suppression from 2 to 18 GHz while simultaneously conducting heat away from sensitive electronic components.
Available in thermal conductivities of 1.5 W/mK or 2.5 W/mK, the DU Series balances electrical and thermal performance in compact designs. Its soft, conformable composition fills air gaps, reduces cavity resonances, and maintains stability under thermal cycling. Standard thicknesses of 0.020″, 0.040″, 0.060″, and 0.080″ are available, with custom dimensions and die-cut parts offered for specific applications.
This unique combination of absorber and thermal pad functions makes the DU Series ideal for next-generation electronics where both signal integrity and thermal reliability are critical. By combining two functions into one material, engineers can reduce part counts, simplify assembly, and achieve more efficient system integration. The DU Series is particularly well-suited for telecom infrastructure, optical modules, interconnects, automotive radar, aerospace avionics, and high-density industrial electronics, where heat buildup and RFI can degrade performance if left unmanaged.
Key Features
- Dual-use functionality: RF absorber and thermal pad in one material
- Broadband attenuation: Effective from 2 to 18 GHz
- Thermal conductivity options: 1.5 W/mK or 2.5 W/mK
- Soft, conformable composition for gap filling
- Stable performance under repeated thermal cycling
- Available in multiple thicknesses: 0.020″, 0.040″, 0.060″, 0.080″
Applications
- Telecom & Networking: Thermal and RFI management in base stations and antenna housings
- Optical Modules & Interconnects: Integrated absorption and heat dissipation for high-speed optical devices and assemblies
- Automotive Electronics: Suppression and cooling in radar, infotainment, and ADAS modules
- Aerospace & Defense: Thermal interface and absorber functions in avionics and communication systems
- Industrial Electronics: Power supplies, control systems, and high-density circuit boards
- Test & Measurement: Chamber components and device packaging requiring both absorption and heat transfer
Common Frequencies
- 2.45 GHz: Common for Wi-Fi, ISM band, and industrial wireless
- 3.5 GHz: Mid-band 5G, C-band interference mitigation
- 5.2 / 5.8 GHz: Dual-band Wi-Fi, UNII bands, and short-range radar suppression
- 6.5 GHz: Intermediate radar and wireless telemetry applications
- 8.0 GHz: X-band radar, high-resolution imaging, and airborne telemetry
- 10.5 GHz: ISM band use and test instrumentation
- 13.56 GHz: High-frequency RFID, industrial sensors, and medical diagnostics
- 15.0 GHz: Point-to-point links, SATCOM intermediate stages
- 17.3 GHz: Ka-band front-end protection and antenna feed isolation
